Semiconductor device, method of manufacturing the same, electronic device, and electronic component

ABSTRACT

A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of the prior International PatentApplication No. PCT/JP2009/067856, filed Oct. 15, 2009, the entirecontents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to a semiconductor device,a method of manufacturing the same, an electronic device, and anelectronic component.

BACKGROUND

Recently, electronic devices such as servers and personal computers havebeen remarkably developed in terms of advancements in speed,performance, and the like, and accordingly semiconductor elements suchas CPU (Central Processing Unit) used in the electronic devices havebeen progressively increased in size.

As a mounting technology for semiconductor elements, flip chip mountingis known in which a semiconductor element in the form of bare chip isdirectly mounted on a wiring board with a solder bump.

Additionally, to scale up the fine electrode arrangement ofsemiconductor elements to the electrode arrangement of a wiring board,there is also a mounting method in a BGA (Ball Grid Array) approach inwhich a semiconductor package having a semiconductor element placed onan interposer is fabricated and mounted on a wiring board with a solderbump interposed therebetween. The semiconductor package for BGA approachis also called a BGA semiconductor package.

FIGS. 1A and 1B are cross-sectional views of a BGA semiconductor package5 in the course of the mounting thereof on a wiring board 1.

As illustrated in FIG. 1A, the wiring board 1 has first electrode pads 2on one main surface thereof. A solder paste 4 is printed in advance onthe first electrode pads 2 by screen printing.

On the other hand, the semiconductor package 5 includes second electrodepads 6 on a main surface thereof at positions facing the first electrodepads 2. Further, solder bumps 7 are bonded to the upper surfaces of thesecond electrode pads 6.

Then, while the solder bumps 7 are in contact with the solder paste 4,these are reflowed by heating. Thereby, the semiconductor package 5 ismounted on the wiring board 1 as illustrated in FIG. 1B. The surfacetension of the solder and the own weight of the semiconductor package 5determine the shape of the solder bumps 7 after the reflowing, which isnormally a drum-like shape bulging at the center as illustrated.

Meanwhile, the semiconductor package 5 and wiring board 1 have differentthermal expansion coefficients because of the difference in materials.Accordingly, as the semiconductor package 5 generates heat, stress isapplied on the solder bumps 7 due to the difference in thermal expansioncoefficient. The stress concentrates on portions of the solder bumps 7where the diameter is the smallest, in other words, around bondedportions A between the electrode pads 2, 6 and the solder bumps 7.

As the power supply of the semiconductor package 5 is turned on and offrepeatedly, the stress is repeatedly applied to the solder bumps 7 inthe bonded portions A. Thus, metal fatigue gradually progresses at thesolder bumps 7. Eventually, a crack is generated in the solder bumps 7,and the bonded portions A may be fractured.

Patent Literature 1: Japanese Laid-open Patent Publication No. 05-114627

Patent Literature 2: International Publication Pamphlet No. WO 08/114434

Patent Literature 3: Japanese Laid-open Patent Publication No.2001-118876 Patent Literature 4: Japanese Laid-open Patent PublicationNo. 08-236898 Patent Literature 5: Japanese National Publication ofInternational Patent Application No. 2005-510618 Non-patent Literature1: Morita, Hayashi, Nakanishi, and Yoneda, “High Acceleration Test ofLead-free Solder”, 23rd Spring Lecture Meeting of Japan Institute ofElectronics Packaging SUMMARY

According to an aspect of the following disclosure, there is provided asemiconductor device including: a wiring board including a firstelectrode pad on a surface thereof; a circuit board disposed to stand onthe wiring board, and including an interconnection connected to thefirst electrode pad; and a semiconductor component disposed to face thewiring board with the circuit board interposed therebetween, andincluding a second electrode pad on a surface thereof, the secondelectrode pad being connected to the interconnection.

Moreover, according to another aspect of the disclosure, there isprovided an electronic device including a semiconductor device mountedthereon, the semiconductor device including: a wiring board including afirst electrode pad on a surface thereof; a circuit board disposed tostand on the wiring board, and including an interconnection connected tothe first electrode pad; and a semiconductor component disposed to facethe wiring board with the circuit board interposed therebetween, andincluding a second electrode pad on a surface thereof, the secondelectrode pad being connected to the interconnection.

Further, according to another aspect of the disclosure, there isprovided an electronic component including: a wiring board including afirst electrode pad on a surface thereof; and a circuit board disposedto stand on the wiring board, and including an interconnection forconnecting the first electrode pad to a second electrode pad of asemiconductor element to be mounted on the wiring board.

In addition, according to still another aspect of the disclosure, thereis provided a method of manufacturing a semiconductor device, the methodincluding: standing a circuit board on a wiring board including a firstelectrode pad on a surface thereof; connecting the first electrode padto an interconnection of the circuit board; mounting a semiconductorcomponent on the circuit board in such a manner that the semiconductorcomponent faces the wiring board with the circuit board interposedtherebetween; and connecting the interconnection of the circuit board toa second electrode pad disposed on a surface of the semiconductorcomponent.

The object and advantages of the embodiments will be realized andattained by means of the elements and combinations particularly pointedout in the claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the embodiments, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are cross-sectional views of a semiconductor element inthe course of the mounting thereof on a wiring board by flip chipmounting;

FIG. 2 is a plan view of a flexible circuit board used in eachembodiment;

FIG. 3 is a cross-sectional view taken along the line I-I in FIG. 2;

FIGS. 4A and 4B are perspective views illustrating a way of using aflexible circuit board according to a first embodiment;

FIG. 5 is a cross-sectional view of a semiconductor device according tothe first embodiment;

FIG. 6 is a plan view of a wiring board used in each embodiment;

FIG. 7 is a plan view of an interposer of a semiconductor package usedin each embodiment;

FIGS. 8A and 8B are enlarged cross-sectional views of the flexiblecircuit board and its surrounding in the semiconductor device accordingto the first embodiment;

FIG. 9 is an enlarged plan view of the semiconductor device according tothe first embodiment;

FIGS. 10A to 10D are cross-sectional views of the flexible circuit boardin the course of the fabricating thereof according to each embodiment;

FIGS. 11A and 11B are plan views of the flexible circuit board in thecourse of the fabricating thereof according to each embodiment;

FIGS. 12A to 12C are cross-sectional views of the semiconductor devicein the course of the manufacturing thereof using the flexible circuitboard according to the first embodiment;

FIG. 13 is a cross-sectional view in a case where the flexible circuitboard is placed between the interposer and a semiconductor element inthe first embodiment;

FIG. 14 is a perspective view illustrating a way of using a flexiblecircuit board according to a second embodiment;

FIG. 15 is an enlarged plan view of an electronic component in which theflexible circuit board according to the second embodiment firmly adheresonto a wiring board;

FIG. 16 is an enlarged plan view of three flexible circuit boards usedin a third embodiment;

FIG. 17 is a perspective view illustrating a way of using the flexiblecircuit board according to the third embodiment;

FIG. 18 is an enlarged plan view of an electronic component in which theflexible circuit boards according to the third embodiment firmly adhereonto a wiring board;

FIGS. 19A to 19D are cross-sectional views illustrating a method offabricating a sample in a fourth embodiment;

FIG. 20 is a plan view of the sample in the fourth embodiment;

FIGS. 21A and 21B are cross-sectional views for explaining a method ofexamining the connection reliability of the sample in the fourthembodiment; and

FIG. 22 is a schematic plan view illustrating a method of measuring aresistance value between a second electrode pad and a third electrodepad in the fourth embodiment.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the present embodiments will be described in detail withreference to the attached drawings.

(1) First Embodiment

FIG. 2 is a plan view of a stress-absorbing flexible circuit board 30used in the present embodiment.

The flexible circuit board 30 has a flexible band-shaped resin basematerial 32 and interconnections 31 buried in the resin base material32. The size of the resin base material 32 is not particularly limited.However, in this embodiment, the length L is approximately 40 mm and thewidth W is approximately 2 mm.

The interconnections 31 are formed to extend in a short-side directionof the band-shaped resin base material 32. As the material of theinterconnections 31, for example, copper is used.

A plurality of such interconnections 31 are formed in the resin basematerial 32 at intervals of approximately 1.27 mm. A slit 32 b is formedin the resin base material 32 at a position between each adjacent two ofthe interconnections 31.

FIG. 3 is a cross-sectional view taken along the line I-I in FIG. 2.

As illustrated in FIG. 3, the resin base material 32 includes a firstresin film 38 and a second resin film 39 which are both made ofpolyimide and are stacked on each other. The interconnection 31 isburied between these resin films 38, 39.

The thickness T of the resin base material 32 combining these resinfilms 38, 39 is not particularly limited, but is approximately 0.1 mm inthis embodiment.

Moreover, the resin base material 32 has openings 32 a formed atportions approximately 0.5 mm from both ends of the interconnection 31,and end portions of the interconnection 31 are exposed from the openings32 a. Incidentally, surface treatment such as gold plating may beperformed on the portions of the interconnection 31 exposed from theopenings 32 a to prevent oxidation and to improve bonding.

FIGS. 4A and 4B are perspective views illustrating a way of using thestress-relaxing flexible circuit board 30.

As illustrated in FIG. 4A, in this embodiment, a plurality of theflexible circuit boards 30 are prepared, and the slits 32 b thereof arefitted to each other.

Thereby, as illustrated in FIG. 4B, the flexible circuit boards 30 areassembled in a lattice pattern. Thus, the flexible circuit boards 30come to stand by themselves without support.

Here, to prevent the flexible circuit boards 30 from varying in height,the depths of the slits 32 b are preferably approximately half the widthW of each flexible circuit board 30 (see FIG. 2).

FIG. 5 is a cross-sectional view of a semiconductor device using theflexible circuit boards 30 thus assembled.

This semiconductor device 10 has a wiring board 11 and a semiconductorpackage 20 as a semiconductor component facing the wiring board 11 withthe flexible circuit boards 30 interposed therebetween.

Among them, the wiring board 11 is a multilayer wiring board includinginterconnections 12 made of copper and insulating layers 13 made of aglass epoxy resin which are alternately stacked. First electrode pads 14made of copper are disposed on the surface of the uppermost layer of thewiring board 11.

Moreover, the semiconductor package 20 includes a semiconductor element21 such as CPU mounted on an interposer 16, and a sealing resin 22sealing the semiconductor element 21 and the interposer 16.

Among them, the interposer 16 is a multilayer wiring board including aplurality of interconnections 17 made of copper and insulating layers 18made of a glass epoxy resin which are alternately stacked. Theinterposer 16 has second and third electrode pads 19, 24 made of copperon the surfaces of the lowermost layer and the uppermost layer thereof,respectively.

In addition, the semiconductor element 21 includes fourth electrode pads25 made of copper. The fourth electrode pads 25 and the third electrodepads 24 of the interposer 16 are electrically and mechanically connectedto each other with solder bumps 26.

Further, a heat sink 23 for efficiently dissipating heat generated fromthe semiconductor element 21 firmly adheres to the surface of thesealing resin 22. The heat sink 23 is made of a metal having a favorablethermal conductivity, for example, aluminum.

FIG. 6 is a plan view of the wiring board 11.

As illustrated in FIG. 6, the planar shape of the wiring board 11 is asquare shape with a length of one side thereof being approximately 110mm, and 26×26 of the first electrode pads 14 are arranged in a latticepattern thereon but 16×16 of the first electrode pads 14 in the centralregion are excluded. Moreover, the size of each first electrode pad 14is not particularly limited, but the first electrode pad 14 is in acircular shape having a diameter of approximately 0.76 mm in thisembodiment.

Meanwhile, FIG. 7 is a plan view of the interposer 16 included in thesemiconductor package 20.

As illustrated in FIG. 7, the planar shape of the interposer 16 is asquare shape with a length of one side thereof being approximately 40mm. Moreover, the second electrode pads 19 disposed on the interposer 16are each in a circular shape having a diameter of approximately 0.76 mm,and have the same arrangement pattern as the first electrode pads 14illustrated in FIG. 6.

FIGS. 8A and 8B are enlarged cross-sectional views of the flexiblecircuit board 30 and its surrounding in the semiconductor device 10.Among them, FIG. 8A is an enlarged cross-sectional view taken parallelto an extending direction of the flexible circuit board 30, while FIG.8B is an enlarged cross-sectional view taken along a directionperpendicular to the extending direction of the flexible circuit board30.

As illustrated in FIGS. 8A and 8B, the band-shaped flexible circuitboards 30 are disposed to stand on the wiring board 11, and extend in alateral direction of the wiring board 11 in such a manner as to run onthe first electrode pads 14.

Moreover, the portions of the interconnection 31 of the flexible circuitboard 30 exposed from the openings 32 a of the resin base material 32are mechanically and electrically connected to the first and secondelectrode pads 14, 19 respectively with first and second connectionmedia 41, 42 such as Sn-3Ag-0.5Cu solder interposed therebetween.

Such connections between the interconnection 31 and the connection media41, 42 at the openings 32 a increase the contact area between theinterconnection 31 and the connection media 41, 42, and improve theconnection reliability between the wiring board 11 and the semiconductorpackage 20 with the circuit boards 30 interposed therebetween, incomparison with a case where no opening 32 a is provided.

Note that the connection media 41, 42 are not limited to solder and maybe a conductive adhesive. Such a conductive adhesive is obtained by, forexample, kneading a binder such as an epoxy resin, a urethane resin, asilicone resin, an acrylic resin, and a polyimide resin with aconductive filler such as silver and copper.

By standing the flexible circuit boards 30 on the wiring board 11 inthis manner, it may be possible to urge the flexible circuit boards 30to deform in in-plane directions D of the wiring board 11 when thewiring board 11 or the semiconductor package 20 thermally expands asillustrated in FIG. 8B.

FIG. 9 is an enlarged plan view of the semiconductor device. Note that,in FIG. 9, the semiconductor package 20 is omitted to facilitatevisualization of the planar layout of the flexible circuit boards 30.

As illustrated in FIG. 9, the plurality of flexible circuit boards 30assembled in the lattice pattern are positioned to the wiring board 11in such a manner that the interconnections 31 are located above thefirst electrode pads 14.

In the semiconductor device 10 described above, the flexible circuitboards 30 are disposed between the wiring board 11 and the semiconductorpackage 20 as illustrated in FIGS. 8A and 8B.

Accordingly, the flexible circuit boards 30 themselves deform to absorbthe difference in thermal expansion between the wiring board 11 and thesemiconductor package 20 caused by heat generated from the semiconductorpackage 20. This may enable prevention of stress from concentrating onbonded portions between the flexible circuit boards 30 and the first andsecond electrode pads 14, 19. Hence, a risk of fracturing bondingbetween the interconnections 31 of the circuit boards 30 and the firstand second electrode pads 14, 19 due to the concentration of stress isreduced. Thus, improvement in connection reliability between the circuitboards 30 and the semiconductor package 20 may be possible.

Particularly, in this embodiment, since the flexible circuit boards 30are disposed to stand on the wiring board 11, the flexible circuitboards 30 may be deformed in the in-plane directions D of the wiringboard 11 as illustrated in FIG. 8B. Thereby, the flexible circuit boards30 may efficiently absorb the difference in thermal expansion betweenthe wiring board 11 and the semiconductor package 20 in the in-planedirections D. Thus, it may be possible to achieve the improvement inconnection reliability by the flexible circuit boards 30.

Next, a method of fabricating the flexible circuit board 30 will bedescribed.

FIGS. 10A to 10D are cross-sectional views of the flexible circuit board30 in the course of the fabricating thereof. FIGS. 11A and 11B are planviews thereof.

To fabricate the flexible circuit board 30, firstly, as illustrated inFIG. 10A, a copper foil 33 is bonded onto a main surface of the firstresin film 38 made of polyimide having a thickness of approximately 0.25mm with an unillustrated adhesive (thickness: approximately 0.25 mm).The thickness of the copper foil 33 is not particularly limited, but isapproximately 0.35 mm in this embodiment.

Incidentally, as the material of the first resin film 38, a materialother than polyimide, for example, epoxy, acrylic, phenol, or the likemay be used.

Then, as illustrated in FIG. 10B, the copper foil 33 is patterned byphotolithography and wet etching to form the interconnections 31. Thewidth of the interconnections 31 obtained by this patterning is, forexample, approximately 0.5 mm.

Subsequently, the second resin film 39 having the openings 32 a formedin advance is prepared as illustrated in FIG. 10C. Then, the secondresin film 39 is pasted on the first resin film 38 with an unillustratedadhesive by pressing, and the resin base material 32 including the resinfilms 38, 39 is obtained.

The material of the second resin film 39 is not particularly limited,and a film made of any one of polyimide, epoxy, acrylic, and phenol maybe used as the second resin film.

In a case where the resin films 38, 39 are pasted on each other at lowtemperature, any one of epoxy, acrylic, and phenol described above ispreferably used as the material of these resin films.

Moreover, the thickness of the second resin film 39 is not particularlylimited, but is approximately 0.25 mm in this embodiment.

Thereafter, as illustrated in FIG. 10D, the openings 32 a are formed inthe first resin film 38 by laser processing, and thus end portions ofthe interconnections 31 are exposed from the openings 32 a.

As described with reference to FIGS. 8A and 8B, the openings 32 a formedin the above manner may increase the contact area between theinterconnections 31 and the connection media 41, 42 in the openings 32a.

Note that, although the openings 32 a are formed in both of the resinfilms 38, 39 in this example, the contact area between theinterconnections 31 and the connection media 41, 42 may be increasedeven if the openings 32 a are formed only in one of these resin films38, 39.

FIG. 11A is an enlarged plan view of the resin base material 32 afterthe steps so far are completed. FIG. 10D preceded above corresponds to across-sectional view taken along the line II-II in FIG. 11A.

After that, as illustrated in FIG. 11B, the slit 32 b is mechanicallyformed in the resin base material 32 at a position between each adjacenttwo of the plurality of interconnections 31 using a puncher.

Thereby, a basic structure of the stress-relaxing flexible circuit board30 is completed.

In manufacturing the semiconductor device, a plurality of such flexiblecircuit boards 30 are fabricated, each of which is assembled into alattice pattern as illustrated in FIGS. 4A and 4B.

FIGS. 12A to 12C are cross-sectional views of the semiconductor devicein the course of the manufacturing thereof using the flexible circuitboards 30 thus assembled. Note that, in FIGS. 12A to 12C, the samereference numerals as in FIGS. 8A and 8B denote the same elementsdescribed in the drawings, and descriptions thereof will be omittedbelow.

To manufacture the semiconductor device 10, firstly, as illustrated inFIG. 12A, Sn-3Ag-0.5Cu solder is printed in advance as the firstconnection media 41 on the first electrode pads 14 of the wiring board11.

Incidentally, instead of such a printing method, solder balls may bemounted in advance as the first connection media 41 on the firstelectrode pads 14.

Then, as illustrated in FIG. 12B, the first electrode pads 14 and theflexible circuit boards 30 are positioned to each other, and theplurality of flexible circuit boards 30 assembled in the lattice patternare mounted on the wiring board 11. The assembling into such a latticepattern may enable the circuit boards 30 to maintain the standing stateon the wiring board 11 by themselves without support.

Thereafter, the solder in the first connection media 41 is reflowed byheating to a temperature at its melting point of 220° C. or higher.

After that, the first connection media 41 are cooled and solidified.Thereby, the interconnections 31 of the flexible circuit boards 30 areconnected to the first electrode pads 14 with the first connection media41 interposed therebetween. In addition, the flexible circuit boards 30are temporarily fixed onto the wiring board 11 by the first connectionmedia 41.

Thus, an electronic component 40 is obtained in which the flexiblecircuit boards 30 are disposed to stand on the wiring board 11.

Subsequently, as illustrated in FIG. 12C, the semiconductor package 20is mounted on the electronic component 40. In this event, Sn-3Ag-0.5Cusolder is printed in advance as the second connection media 42 on thesecond electrode pads 19 of the semiconductor package 20. Thesemiconductor package 20 is mounted on the flexible circuit boards 30with the second connection media 42 interposed therebetween.

Incidentally, instead of forming the second connection media 42 by theprinting method, solder balls may be mounted as the second connectionmedia 42 on the second electrode pads 19.

Thereafter, the solder in the second connection media 42 in this stateis reflowed by heating to a temperature at its melting point of 220° C.or higher.

After that, the second connection media 42 are cooled and solidified.Thereby, the interconnections 31 of the flexible circuit boards 30 areconnected to the second electrode pads 19 with the second connectionmedia 42 interposed therebetween. In addition, the semiconductor package20 is fixed onto the flexible circuit boards 30 by the second connectionmedia 42.

Thereby, a basic structure of the semiconductor device according to thepresent embodiment is obtained.

Incidentally, although solder is used as the first and second connectionmedia 41, 42 in the above description, a conductive adhesive may be usedinstead.

Further, in the above description, stress-absorbing flexible circuitboards 30 are placed between the semiconductor package 20 and the wiringboard 11. The positions where the circuit boards 30 are disposed are notlimited thereto.

For example, as illustrated in an enlarged cross-sectional view of FIG.13, to connect the interposer 16 to the semiconductor element 21, theflexible circuit boards 30 may be placed therebetween. Note that, inFIG. 13, the same reference numerals as in FIG. 5 denote the sameelements in FIG. 5, and descriptions thereof will be omitted below.

In this case, solder or a conductive adhesive is provided in advance asthe first and second connection media 41, 42 on the third and fourthelectrode pads 24, 25. The circuit boards 30 are electrically andmechanically connected to the third and fourth electrode pads 24, 25 bythe connection media 41, 42.

Thereby, the flexible circuit boards 30 may absorb the difference inthermal expansion between the semiconductor element 21 and theinterposer 16, and the connection reliability between the semiconductorelement 21 and the interposer 16 may be improved.

By standing the flexible circuit boards 30 on the semiconductor board 11as described above in this embodiment, it may be possible to provide asemiconductor device having improved connection reliability between thewiring board 11 and the semiconductor component such as thesemiconductor package 20 and the semiconductor element 21. Moreover, bymounting the semiconductor device on an electronic device such as aserver or a personal computer, it may be possible to urge furtheradvancement in performance of the electronic device.

(2) Second Embodiment

The present embodiment is different from the first embodiment in how toassemble the flexible circuit board 30, and is the same as the firstembodiment in the other points.

FIG. 14 is a perspective view illustrating a way of using the flexiblecircuit board 30 according to the present embodiment.

As illustrated in FIG. 14, in this embodiment, the single flexiblecircuit board 30 is wound spirally.

FIG. 15 is an enlarged plan view of an electronic component 50 in whichthe flexible circuit board 30 firmly adheres onto the wiring board 11.

As illustrated in FIG. 15, the flexible circuit board 30 is disposed tostand on the wiring board 11 in such a manner that the interconnections31 run on the first electrode pads 14. In addition, the flexible circuitboard 30 is wound spirally by being bent at appropriate positions.

While formed spirally in this manner, even the single flexible circuitboard 30 alone may crawl on all the first electrode pads 14. Thus, itmay be no longer necessary to prepare a plurality of flexible circuitboards 30 nor to form slits 32 b therein to assemble the circuit boards30 as in the first embodiment. This facilitates processing of theflexible circuit board 30.

Furthermore, by bending the flexible circuit board 30 at appropriatepositions, the flexible circuit board 30 may be allowed to crawl on theelectrode pads 14 regardless of the planar layout of the first electrodepads 14. Thus, the versatility of the flexible circuit board 30 isenhanced.

(3) Third Embodiment

The present embodiment is different from the first embodiment in how toassemble the flexible circuit board 30, and is the same as the firstembodiment in the other points.

FIG. 16 is an enlarged plan view of three flexible circuit boards 30used in the present embodiment.

As illustrated in FIG. 16, two of the three flexible circuit boards 30each have the slit 32 b cut from one of the long sides, while theremaining one of the flexible circuit boards 30 has the slits 32 b cutfrom both of the long sides.

When in use, these three flexible circuit boards 30 are assembled indirections of the arrows in the drawing.

FIG. 17 is a perspective view illustrating a way of using the flexiblecircuit board 30 according to the present embodiment.

In this embodiment, the slits 32 b of the three flexible circuit boards30 illustrated in FIG. 16 are fitted to each other, so that the flexiblecircuit boards 30 are radially assembled with the slits 32 b as thecenter as illustrated in FIG. 17.

FIG. 18 is an enlarged plan view of an electronic component 60 in whichthe flexible circuit boards 30 thus radially assembled firmly adhereonto the wiring board 11.

As illustrated in FIG. 18, the flexible circuit boards 30 are disposedto stand on the wiring board 11 in such a manner that theinterconnections 31 run on the first electrode pads 14.

Even in such a radial form, the flexible circuit boards 30 deform as inthe first embodiment. Thereby, the flexible circuit boards 30 may absorbthe difference in thermal expansion between the wiring board 11 and thesemiconductor package 20, and the connection reliability between thewiring board 11 and the semiconductor package 20 may be improved.

(4) Fourth Embodiment

In this embodiment, a study carried out by the inventors of the presentapplication will be described. In the study, the flexible circuit boards30 are disposed between the wiring board and the semiconductor packageas in the first embodiment, and then it is examined that to what extentthe connection reliability between the wiring board and thesemiconductor package has been improved.

FIGS. 19A to 19D are cross-sectional views illustrating a method offabricating a sample used in the study. Note that, in these drawings,the same reference numerals as those in the first embodiment denote thesame elements described in the first embodiment, and descriptionsthereof will be omitted below.

To fabricate the sample, firstly, as illustrated in FIG. 19A, theflexible circuit boards 30 and a package board 70 are prepared.

Among them, the package board 70 functions as a pseudo-semiconductorpackage in the study, and has first electrode pads 71 and secondelectrode pads 72 on the respective surfaces of a resin base material74. Moreover, the first and second electrode pads 71, 72 are connectedto each other through via holes 74 a formed in the resin base material74.

Further, the flexible circuit boards 30 and the package board 70 areelectrically and mechanically connected to each other with firstconnection media 75 such as solder interposed therebetween.

Here, in the study, among the plurality of interconnections 31 of theflexible circuit boards 30, interconnections 31 at right and left endsare connected to the first electrode pads 71, while the remaininginterconnections 31 are not connected to the package board 70.

Then, as illustrated in FIG. 19B, a wiring board 80 having a pluralityof third electrode pads 83 formed on a resin base material 82 isprepared. Subsequently, a solder paste is printed as second connectionmedia 87 by a printing method or the like on third electrode pads 83 atright and left ends among the plurality of third electrode pads 83.

Next, as illustrated in FIG. 19C, the interconnections 31 at both endsof the flexible circuit boards 30 are positioned to the third electrodepads 83 at both ends of the wiring board 80. Then, the flexible boards30 are made to stand on the second connection media 87.

Thereafter, as illustrated in FIG. 19D, the second connection media 87are reflowed and melted. Thereby, the interconnections 31 of theflexible circuit boards 30 are electrically and mechanically connectedto the third electrode pads 83 of the wiring board 80 with the secondconnection media 87 interposed therebetween.

Note that Sn-37Pb solder is used as the connection media 75, 87.

Thereby, a basic structure of a sample S is completed.

FIG. 20 is a plan view of this sample S. FIG. 19D preceded abovecorresponds a cross-sectional view taken along the line in FIG. 20.

As illustrated in FIG. 20, in the sample S, four flexible circuit boards30 are assembled and disposed to stand along edges of the package board70.

Among these flexible circuit boards 30, two flexible circuit boards 30disposed opposite to each other at upper and lower portions of thedrawing are electrically and mechanically connected to both the packageboard 70 and the wiring board 80. The two flexible circuit boards 30 areconnected to the package board 70 and the wiring board 80 at connectionportions B respectively with the first and second connection media 75,87 interposed therebetween as already mentioned.

Using such a sample S, the inventors of the present application examinethe connection reliability in the following way.

FIGS. 21A and 21B are cross-sectional views for explaining a method ofexamining the connection reliability.

In the study, the sample S is mounted on a support 90 with the packageboard 70 at the lower side of the sample S. The support 90 is providedwith a recessed portion 90 a. The flexible circuit boards 30 and thepackage board 70 are housed in the recessed portion 90 a.

Then, using a piston 91 as in FIG. 21A, the wiring board 80 and thepackage board 70 are pushed down vertically by 1.5 mm and returned tothe initial position as in FIG. 21B. This cycle is repeated at afrequency of 0.5 Hz. Simultaneously with this, a resistance value Rbetween the second electrode pad 72 and the third electrode pad 83 ismeasured. The measurement is performed in a room with the roomtemperature of approximately 25° C. Such a study is also called abending test.

The bending test is expected to be a method in which the lifetime of abonded portion with respect to fatigue may be measured within a shortperiod, in comparison with a temperature cycle test.

FIG. 22 is a schematic plan view illustrating a method of measuring theresistance value R.

As illustrated in FIG. 22, two first test pads 79 connected to thesecond electrode pad 72 are disposed on the surface of the package board70. Moreover, two second test pads 89 electrically connected to thethird electrode pad 83 are disposed on the surface of the wiring board80.

In measuring the resistance value R, a voltage V generated between thethird and second electrode pads 83 and 72 is measured with a voltmeter95, while a constant current I is caused to flow between one of the twofirst test pads 79 and one of the two second test pads 89 by a directcurrent generator 96. The resistance value R is obtained from R=V/I.

In the study, at the time when the resistance value R is increasedhigher than the initial value by 1% after the test is started, theconnection portion B (see FIG. 20) between the package board 70 and thewiring board 80 is regarded as being broken down. As a result, it isconfirmed that the lifetime of the connection portion B in the sample Sis 8 times or more as long as that in a case where the boards 70, 80 areconnected with the solder bumps 7 interposed therebetween as in FIG. 1B.

Thus, it is supported that connecting the package board 70 and thewiring board 80 with the flexible boards 30 as in the sample S iseffective in improving the connection reliability between the boards 70,80.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the inventionand the concepts contributed by the inventor to furthering the art, andare to be construed as being without limitation to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority andinferiority of the invention. Although the embodiments of the presentinventions have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

1. A semiconductor device comprising: a wiring board including a firstelectrode pad on a surface thereof; a circuit board disposed to stand onthe wiring board, and including an interconnection connected to thefirst electrode pad; and a semiconductor component disposed to face thewiring board with the circuit board interposed therebetween, andincluding a second electrode pad on a surface thereof, the secondelectrode pad being connected to the interconnection.
 2. Thesemiconductor device according to claim 1, wherein the circuit board isa flexible circuit board.
 3. The semiconductor device according to claim2, wherein a plurality of the flexible circuit boards are disposed, theplurality of the flexible circuit boards have slits formed therein, andthe plurality of the flexible circuit boards are assembled in a latticepattern with the slits being fitted to each other.
 4. The semiconductordevice according to claim 2, wherein a plurality of the flexible circuitboards are disposed, the plurality of the flexible circuit boards haveslits formed therein, and the plurality of the flexible circuit boardsare radially assembled with the slits being fitted to each other.
 5. Thesemiconductor device according to claim 2, wherein a plurality of thefirst electrode pads are disposed, and the flexible circuit board iswound spirally in such a manner as to run on each of the plurality ofthe first electrode pads.
 6. The semiconductor device according to claim1, wherein the interconnection is connected to the first electrode padand the second electrode pad with any one of solder and a conductiveadhesive.
 7. The semiconductor device according to claim 6, wherein theflexible circuit board comprises: a first resin film having theinterconnection formed on one main surface thereof; and a second resinfilm formed on the interconnection and the first resin film, at leastone of the first resin film and the second resin film has an openingformed on an end portion of the interconnection to expose theinterconnection therefrom, and the end portion of the interconnection isconnected to any one of the first electrode pad and the second electrodepad.
 8. The semiconductor device according to claim 2, wherein a planarshape of the flexible circuit is a band shape.
 9. The semiconductordevice according to claim 8, wherein the interconnection extends in ashort-side direction of the band-shaped flexible circuit board.
 10. Anelectronic device comprising a semiconductor device mounted thereon, thesemiconductor device comprising: a wiring board including a firstelectrode pad on a surface thereof; a circuit board disposed to stand onthe wiring board, and including an interconnection connected to thefirst electrode pad; and a semiconductor component disposed to face thewiring board with the circuit board interposed therebetween, andincluding a second electrode pad on a surface thereof, the secondelectrode pad being connected to the interconnection.
 11. An electroniccomponent comprising: a wiring board including a first electrode pad ona surface thereof; and a circuit board disposed to stand on the wiringboard, and including an interconnection for connecting the firstelectrode pad to a second electrode pad of a semiconductor element to bemounted on the wiring board.
 12. The electronic component according toclaim 11, wherein a plurality of the circuit boards are disposed, theplurality of the circuit boards have slits formed therein, and theplurality of the circuit boards are assembled in a lattice pattern withthe slits being fitted to each other.
 13. The electronic componentaccording to claim 11, wherein a plurality of the circuit boards aredisposed, the plurality of the circuit boards have slits formed therein,and the plurality of the circuit boards are radially assembled with theslits being fitted to each other.
 14. The electronic component accordingto claim 11, wherein a plurality of the first electrode pads aredisposed, and the circuit board is wound spirally in such a manner as torun on each of the plurality of the first electrode pads.
 15. A methodof manufacturing a semiconductor device, the method comprising: standinga circuit board on a wiring board including a first electrode pad on asurface thereof; connecting the first electrode pad to aninterconnection of the circuit board; mounting a semiconductor componenton the circuit board in such a manner that the semiconductor componentfaces the wiring board with the circuit board interposed therebetween;and connecting the interconnection of the circuit board to a secondelectrode pad disposed on a surface of the semiconductor component. 16.The method of manufacturing a semiconductor device according to claim15, wherein the connecting the first electrode pad to theinterconnection is performed by connecting the first electrode pad tothe interconnection with a first connection medium interposedtherebetween.
 17. The method of manufacturing a semiconductor deviceaccording to claim 15, wherein the connecting the interconnection to thesecond electrode pad is performed by connecting the interconnection tothe second electrode pad with a second connection medium interposedtherebetween.
 18. The method of manufacturing a semiconductor deviceaccording to claim 15, further comprising: preparing a plurality of thecircuit boards and forming slits in the circuit boards, and wherein thestanding the circuit board on the wiring board is performed while theplurality of the circuit boards are assembled with the slits in theplurality of the circuit boards being fitted to each other.
 19. Themethod of manufacturing a semiconductor device according to claim 18,wherein the standing the circuit board on the wiring board is performedwhile the plurality of the circuit boards are assembled into a latticepattern or radially.
 20. The method of manufacturing a semiconductordevice according to claim 15, wherein a plurality of the first electrodepads are formed on the wiring board, and the standing the circuit boardon the wiring board is performed while the circuit board is woundspirally in such a manner as to run on each of the plurality of thefirst electrode pads.